q to manage “EUV” masks and “EUV” reticles designed for built-in circuits, not specified by 3B001.g, and having a mask “substrate blank” specified by 3B001.j.” A technological Be aware is included to make clear that masks or reticles with a mounted pellicle are thought of masks and reticles.

Sure, except for the subsequent: (one) “technological innovation” for the “enhancement” or “production” of commodities with the “Adjusted Peak functionality” (“application”) exceeding 70 WT or to the “improvement” or “manufacturing” of commodities controlled by 4A005 or “software” managed by 4D004; or

built-in circuits produced with GAAFET engineering tend to be more economical and able than Those people developed with earlier architectures. It is predicted the scaled and dense microchips generated with GAAFET technological innovation can even be much more tolerant to the consequences of radiation. The larger performance and lower electrical power intake of GAAFET-produced chips empower speedier and more sturdy synthetic intelligence and various armed service and commercial purposes.

h does not Command multi-layer masks having a stage change layer created for the fabrication of memory units not managed by 3A001.

j. Mask “substrate blanks” with multilayer reflector construction consisting of molybdenum and silicon, and having all of the subsequent:

bond, interlayer, prime coat) of fabric deposited around the substrate. These coatings are created to safeguard substrates made out of CMC products from drinking water vapor or corrosive gases created all through combustion reactions. This corrosiveness brings about immediate area recession, which erodes structural integrity and mechanical strength. A license is required to export or reexport ECCN 2E903 “technological know-how”, not specified somewhere else, for that “improvement” or “creation” of `coating systems' to all Locations as specified pursuant to the national stability controls and license critique coverage set forth in § 742.

complex Notice: to the purposes of 3E001 and 3E905, a `method design and style package' (`PDK') is often a computer software Instrument supplied by a semiconductor manufacturer to make certain that the demanded style tactics and guidelines are taken into account to be able to effectively deliver a selected built-in circuit layout in a certain semiconductor procedure, in accordance with technological and production constraints (Every semiconductor production procedure has its specific `PDK').

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missing similar information on the remaining technologies, BIS is employing considered export and reexport controls for international persons for “technological innovation” and “computer software” in ECCNs 2D910 and 2E910 for additive manufacturing equipment (2B910).

any one publishing enterprise private information must Plainly discover the organization private part at some time of submission, file a press release justifying nondisclosure and referring to the particular legal authority claimed, and supply a non-confidential Edition with the submission.

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You will find a limited deemed export or considered reexport exclusion within the license demands in paragraph (a)(ten)(i) of this part for the following “software program” or “know-how” ECCNs, Except if for overseas persons whose newest citizenship or everlasting residency is actually a destination laid out in Country Group D:1 or D:five: 2D910; 2E910;3D001 (“software program” for “EUV” masks and reticles in ECCN 3B001. q); 3D901 (for “software program” for quantum objects in ECCNs 3A901.b, 3B904 and scanning electron microscopes (SEM) in ECCN 3B903); 3D907 “computer software” intended to extract “GDSII” or equal facts; 3E001 (“technological innovation” for “EUV” masks and reticles in ECCN 3B001.